Jointly with its customers Dyconex is investigating the opportunities of Molded Interconnect Devices targeting applications in medical and defense markets. Also named 3D-MIDs, the stable 3-dimensional form the complements the capabilities of the flexible Printed Circuit Board for low- to mid-complexity interconnects with high 3D-alignment precision requirements.

In collaboration with supply chain partners customer designs are analyzed for their suitability to use MID technology for achieving higher value for the customer. Driving forces are simplification, integration and miniaturization of the final product. For quickly mastering the field Dyconex has joined the 3D-MID e.V., an association that has been driving the developments of MID technology for more than 15 years.

A Dyconex representative will be present at the upcoming 3D-MID Conference in Fürth/Germany on September 24/25, 2008 to discuss your interconnection topics. Please advise us so we can arrange an appointment: mail@dyconex.com

More information about the conference, you will find at:

http://www.3d-mid.de/english/news/congress-mid/congress.html