Dyconex will be present at the 3rd annual MEPTEC Medical Electronics Symposium.

Our Regional Manager Director from USA, Thomas Jacob, will talk about the technical trends for medical implantable and similar high-end PCB applications:

“The technical requirements for printed circuit boards used in medical devices are changing fast. The ongoing trend for miniaturization of components in combination with the stringent need for higher performance at lower cost influences heavily the design of the boards. Stacked constructions and multiple origami type bended flexes become a new standard at the micro-via based HDI technology already is for almost ten years now. Implantable medical device manufactures look heavily into hermetic and biocompatible plastic materials such as Liquid Crystal Polymers and PEEK for wireless data transfer through the body. Ever and ever higher resolution in medical diagnostic e.g. ultrasound of sensors pushes the envelope towards extreme fine conductor patterns and metallizations known only from thin-film technology. The conventional PCB technology gets stuck to accomplish the task. Recent developments originally designed to serve complete different industries and operating in hot new markets as for example the photovoltaic, batteries, OLED displays, rapid prototyping may now infuse PCB manufacturers with entire new ways and materials to create very advanced substrates. This presentation concentrates on some selected promising old and new technologies and will try to evaluate the consequences for existing and potential new medical applications.”

We invite you to attend the Symposium at Thursday, September 25, 2008 at the Arizona State University in Tempe, AZ. More information, you will find at: https://meptec.org/meptecmedicalele.html